Senior Advanced Packaging & Reliability hos Smart High Tech i Göteborg
Utvärderar material för halvledarförpackningar samt utför tillförlitlighetstester och haverianalyser. Kräver masterexamen eller doktorsexamen inom relevant tekniskt område samt erfarenhet av halvledarförpackning och tillförlitlighetsteknik.
Titel, arbetsplatsens namn och sammanfattning skrivna av AI utifrån annonsen.
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Lön
Inom yrkesgruppen Civilingenjörsyrken inom kemi och kemiteknik har de som jobbar i privat sektor i Västsverige i snitt 55 400 kr i månaden, varav 54 500 kr i grundlön. I hela landet, i privat sektor, tjänar hälften mellan 44 100 kr och 59 800 kr. Det är statistik för yrket, inte vad den här arbetsgivaren betalar.
Källa: SCB, lönestrukturstatistik 2025
Anställningen
Anställningen har inget slutdatum. Den kan börja med en provanställning på högst sex månader. Vill arbetsgivaren avsluta den under provtiden ska du få besked minst två veckor i förväg; annars blir den en vanlig tillsvidareanställning när provtiden är slut. Därefter krävs sakliga skäl för att säga upp dig, och uppsägningstiden är minst en månad, längre ju längre du har varit anställd.
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Källa: Lagen om anställningsskydd (LAS)
Arbetsgivaren
Smart High Tech har annonserat 8 jobb det senaste året: 7 tidsbegränsade anställningar och 1 tillsvidareanställning. Inom yrkesgruppen Civilingenjörsyrken inom kemi och kemiteknik har de annonserat 2 gånger de senaste två åren, den här annonsen inräknad.
Källa: vår sammanställning av Arbetsförmedlingens annonser
Senior Advanced Packaging & Reliability Engineer
Senior Advanced Packaging & Reliability EngineerJoin Smart High Tech
Smart High Tech is a Swedish DeepTech company developing advanced graphene-enhanced Thermal Interface Materials (TIM) for next-generation AI, semiconductors, high-performance computing, data centres and advanced electronics.
As semiconductor performance and power density continue to increase, advanced packaging, thermal management and long-term reliability are becoming increasingly critical.
We are now strengthening our R&D team with a Senior Advanced Packaging & Reliability Engineer who wants to help solve these challenges and contribute to the next generation of semiconductor technology.
Your Mission
As Senior Advanced Packaging & Reliability Engineer, you will work at the intersection of advanced packaging, materials science, thermal management and reliability engineering.
You will help us understand how our materials and interfaces perform within advanced semiconductor packaging environments by combining simulation, experimental testing, reliability assessment and failure analysis.
You will work closely with our R&D, engineering and product development teams as well as international customers, research institutes and technology partners.
What You'll Be Doing
- Advanced Packaging & Reliability
Evaluate materials and interfaces for advanced semiconductor packaging applications.
Work with technologies such as 2.5D/3D integration, heterogeneous integration, flip-chip and wafer-level packaging.
Develop and perform reliability assessments and testing.
Investigate thermal, mechanical and interfacial failure mechanisms.
Conduct failure analysis and root-cause investigations.
Modelling & Simulation
Perform thermo-mechanical modelling and finite element analysis.
Model stresses, deformation and failure mechanisms in packaging structures and interfaces.
Correlate simulation results with experimental data.
Use simulation and testing to support material and product optimisation.
R&D & Product Development
Support the development and qualification of new materials and products.
Translate technical findings into practical engineering improvements.
Contribute to customer qualification and technical development projects.
Collaborate with universities, research institutes, laboratories and international technology partners.
What We're Looking For
MSc or PhD in Electronic Packaging, Microelectronics, Materials Science, Mechanical Engineering, Applied Mechanics or a related field.
Experience in semiconductor packaging and/or power electronics packaging.
Strong understanding of advanced packaging technologies, materials and interfaces.
Experience in reliability engineering and/or failure analysis.
Experience with thermo-mechanical modelling and finite element analysis.
Familiarity with ANSYS, Abaqus and/or COMSOL.
Strong analytical and problem-solving capabilities.
Fluent English, written and spoken.
It's a Strong Plus If You Have
A PhD within a relevant technical discipline.
Experience with 2.5D/3D integration, heterogeneous integration, WLCSP, flip-chip or advanced interconnects.
Knowledge of solder joints, Cu-based interconnects, sintered materials, microbumps or bonding technologies.
Experience with electromigration, thermal fatigue, creep, fracture or interfacial reliability.
Experience with SEM, TEM, FIB or similar characterisation techniques.
Experience from leading semiconductor companies, packaging companies or research institutes such as IMEC, Fraunhofer, Max Planck, NXP, Nexperia, Infineon, STMicroelectronics, Intel, TSMC, ASE or Amkor.
Publications or patents within advanced packaging, interconnect technologies or reliability.
Who You Are
You're technically curious, analytical and motivated by solving complex engineering challenges.
You're comfortable moving between simulation, experimental testing and physical analysis and can translate scientific findings into practical engineering solutions.
You enjoy working collaboratively in an international DeepTech environment where research, engineering and industrialisation come together.
Avsnitt som inte handlar om jobbet är utelämnade. Hela annonsen finns hos Arbetsförmedlingen.
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